| 摘要 |
<p>A wafer crack detection system includes a rotational wafer stage assembly configured to secure a wafer and selectively rotate the wafer, a light source positioned on a first side of the wafer and configured to direct a light beam through the wafer, a sensor positioned on a second side of the wafer and configured to monitor one or more characteristics of light transmitted through the wafer as the wafer is rotated, and a controller communicatively coupled to the sensor and a portion of the rotational wafer stage assembly, the controller configured to: determine the presence of one or more cracks in the wafer based on the monitored one or more characteristics of light transmitted through the wafer, and, responsive to the determination of the presence of one or more cracks in the wafer, direct the rotational stage assembly to adjust the rotational condition of the wafer.</p> |
