| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive fine particle capable of sufficiently reducing initial resistance without impairing connection reliability when applied to pressure connection at low pressure.SOLUTION: There is provided a conductive fine particle which has a resin particle and at least one conductive metal layer formed on a surface of the resin particle, wherein the resin particle has a number average particle diameter of 8 to 50 μm, the compressive modulus is 100 to 3000 N/mmwhen the particle diameter is displaced by 10%, and when the recovery rate (%) when the particle diameter is displaced by 60% is defined as A and the recovery rate (%) when the particle diameter is displaced by 10% is defined as B, the value of A/B is 1.5 or more. |
