发明名称 ANALYTIC CONTINUATIONS TO THE CONTINUUM LIMIT IN NUMERICAL SIMULATIONS OF WAFER RESPONSE
摘要 <p>Simulations of metrology measurements of a structure may be performed on a metrology model of the structure at two or more different truncation orders up to a maximum truncation order. The simulation results can be fitted to a function of a form that reflects the fact that a truncation order of infinity is an analytic point that admits Taylor series expansion. The function can be extrapolated to a truncation order approaching infinity limit to obtain a high fidelity result. Fitted parameters for the function can be obtained using simulation results for two or more truncation orders that are less than the maximum truncation by fitting the simulation results for the truncation orders to the function. A simulated metrology signal can be obtained by performing a simulation using an optimized truncation order that is less than the maximum truncation order, the function and the one or more fitted parameters.</p>
申请公布号 WO2014074416(A1) 申请公布日期 2014.05.15
申请号 WO2013US68149 申请日期 2013.11.01
申请人 KLA-TENCOR CORPORATION 发明人 BRINGOTZ, BARAK
分类号 H01L21/66 主分类号 H01L21/66
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