| 发明名称 |
THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other. |
| 申请公布号 |
US2014133107(A1) |
申请公布日期 |
2014.05.15 |
| 申请号 |
US201314078033 |
申请日期 |
2013.11.12 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHANG GEON SE;WI SUNG KWON;KIM YONG SUK |
| 分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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