发明名称 |
INLET-AIR-COOLING DOOR ASSEMBLY FOR AN ELECTRONICS RACK |
摘要 |
A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack. |
申请公布号 |
US2014133098(A1) |
申请公布日期 |
2014.05.15 |
申请号 |
US201213674217 |
申请日期 |
2012.11.12 |
申请人 |
CORPORATION INTERNATIONAL BUSINESS MACHINES;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;DAVID MILNES P.;ELLSWORTH, JR. MICHAEL J.;SCHMIDT ROGER R.;SIMONS ROBERT E.;ZAMBRANO DANIEL E. |
分类号 |
H05K7/20;F28F9/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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