发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness. |
申请公布号 |
US2014131886(A1) |
申请公布日期 |
2014.05.15 |
申请号 |
US201313758359 |
申请日期 |
2013.02.04 |
申请人 |
PAEK JONG SIK;PARK DOO HYUN |
发明人 |
PAEK JONG SIK;PARK DOO HYUN |
分类号 |
H01L23/48;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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