| 摘要 |
Disclosed is a cutting apparatus for nonmetal substrates which suppresses a bending phenomenon when cutting nonmetal substrates to improve linearity. The present invention comprises: a base unit accommodating the target nonmetal substrates; a first initial cracker which is installed in the base unit to form an initial crack at the time of cutting the nonmetal substrates; a scribing unit which is installed on the base unit to irradiate a laser beam along the initial cracks formed on the nonmetal substrates; and a second initial cracker which is installed on the base unit to form an induced crack which forms a straight line with a starting point for the crack on the opposite side of the starting point of the initial crack. Therefore, by enabling the induced crack to form a straight line with the initial crack, the nonmetal substrate can be cut without the bending phenomenon on the end part after scribing is formed when the nonmetal substrate is being cut. |
