发明名称 THERMOSETTING RESIN MOLDING AND THERMOSETTING RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To improve the smoothness of a surface of a fiber-reinforced plastic, thereby improving the design.SOLUTION: A thermosetting resin molding of this invention is a thermosetting resin molding containing fibrous reinforcement materials, where a linear expansion coefficient X of the molding and a linear expansion coefficient Y of the fibrous reinforcement materials have the relationship of 0.5≤X/Y≤2.</p>
申请公布号 JP2014087945(A) 申请公布日期 2014.05.15
申请号 JP20120238040 申请日期 2012.10.29
申请人 PANASONIC CORP 发明人 KAMIHIRA MAI ; SAITO EIICHIRO ; IKOMA YOSHIMITSU
分类号 B29B11/16;B29C70/06;B29K105/08 主分类号 B29B11/16
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