发明名称 CONTACT
摘要 This contact is characterized by being provided with: a spring member that is configured from at least one thin sheet having conductivity and elasticity, and that elastically deforms sandwiched between at least one conductive pattern of a printed circuit board and at least one conductive member that is not the printed circuit board; a resin housing that supports the spring member on the printed circuit board and encircles at least a portion of the spring member from at least the two sides sandwiching the direction of deformation of each section of the spring member; and at least a pair of engagement sections that are respectively formed at the spring member and the housing, engage to each other when the housing is disposed at the position encircling the spring member, and affixes at least a portion of the spring member to at least a portion of the housing.
申请公布号 WO2014073495(A1) 申请公布日期 2014.05.15
申请号 WO2013JP79756 申请日期 2013.11.01
申请人 KITAGAWA INDUSTRIES CO., LTD. 发明人 NAKAMURA, TATSUYA
分类号 H01R13/24;H01R12/55 主分类号 H01R13/24
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