| 摘要 |
The present invention provides a resin film which is suitable for use as a sacrificial layer that is used in the technical field of MEMS. The present invention is a resin film which is composed of (A) an acrylic resin that has a glass transition point (Tg) of 40-80°C, while having a functional group that is reactive with an epoxy resin, (B) an epoxy resin, (C) a phenolic resin, and (D) tetraphenylphosphonium tetra(p-tolyl)borate. |
