发明名称 APPARATUS FOR TREATING SUBSTRATE
摘要 An embodiment of the invention provides an apparatus and a method for spraying treatment liquid on a substrate. A substrate treating apparatus comprises a housing having a space for treating a substrate; a spin head for supporting and rotating the support in the housing; and a spray unit for spraying liquid to the substrate on the spin head. The spray unit includes a first nozzle member spraying first treatment liquid, a second nozzle member spraying second treatment liquid, and a nozzle arm supporting the first and second nozzle members. The first nozzle member includes a body and a vibrator. A spray fluid path, in which the first treatment liquid flows, and a plurality of spray holes, which are connected to the fluid path and spray the first treatment liquid, are formed on a bottom surface of the body. The vibrator supplies vibration to the first treatment liquid that flows in the spray fluid path. Therefore, the first treatment liquid, which is sprayed on the substrate, is bounced to a region on the substrate, where a liquid membrane is formed by the second treatment liquid, so as to minimize reverse-contamination of the substrate.
申请公布号 KR20140058190(A) 申请公布日期 2014.05.14
申请号 KR20120124915 申请日期 2012.11.06
申请人 SEMES CO., LTD. 发明人 CHOI, KI HOON;KIM, SEONG SOO
分类号 H01L21/302 主分类号 H01L21/302
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