发明名称 |
Connection structure of circuit board |
摘要 |
A connection structure of circuit boards is disclosed. In one aspect, the connection structure includes a first circuit board 100, a second circuit board 200 and an adhesive member 150. A first connection pad 110 and a second connection pad 120 are disposed on the first circuit board. The second circuit board has a first surface 200a facing the first circuit board. A plurality of third connection pads 210 and fourth connection pads 220 are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first and second circuit boards. At least one of the third and fourth connection pads is electrically connected to a wire 270 which is disposed on a second surface 200b of the second circuit board opposite to the first surface of the second circuit board. |
申请公布号 |
EP2731411(A2) |
申请公布日期 |
2014.05.14 |
申请号 |
EP20130192198 |
申请日期 |
2013.11.08 |
申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
LEE, JIN-SUK |
分类号 |
H05K3/36;H01R12/52;H05K1/11;H05K3/32 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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