发明名称 Connection structure of circuit board
摘要 A connection structure of circuit boards is disclosed. In one aspect, the connection structure includes a first circuit board 100, a second circuit board 200 and an adhesive member 150. A first connection pad 110 and a second connection pad 120 are disposed on the first circuit board. The second circuit board has a first surface 200a facing the first circuit board. A plurality of third connection pads 210 and fourth connection pads 220 are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first and second circuit boards. At least one of the third and fourth connection pads is electrically connected to a wire 270 which is disposed on a second surface 200b of the second circuit board opposite to the first surface of the second circuit board.
申请公布号 EP2731411(A2) 申请公布日期 2014.05.14
申请号 EP20130192198 申请日期 2013.11.08
申请人 SAMSUNG DISPLAY CO., LTD. 发明人 LEE, JIN-SUK
分类号 H05K3/36;H01R12/52;H05K1/11;H05K3/32 主分类号 H05K3/36
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