发明名称 |
Polishing apparatus |
摘要 |
<p>A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material:</p> |
申请公布号 |
EP2502705(B1) |
申请公布日期 |
2014.05.14 |
申请号 |
EP20120004630 |
申请日期 |
2008.10.29 |
申请人 |
EBARA CORPORATION |
发明人 |
NABEYA, OSAMU;TOGAWA, TETSUJI;YASUDA, HOZUMI;SAITO, KOJI;FUKUSHIMA, MAKOTO |
分类号 |
B24B37/32;B24B37/04;B24B37/30;H01L21/304 |
主分类号 |
B24B37/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|