ADHESIVE FILM FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER AND METHOD FOR PROTECTING SEMICONDUCTOR WAFER USING THE SAME

摘要

The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer to prevent damage to a wafer and a wafer bump formation surface and contamination during the grinding process of a bump non-formation surface of the surface of a semiconductor wafer. More specifically, the present invention relates an adhesive film for protecting the surface of a semiconductor wafer including a base film and an intermediate layer laminated on the base film. The intermediate layer includes an acrylic resin containing an alkyl (meth) acrylate monomer with two or more carbon atoms of an alkyl group. The elongation rate of the base film with laminated intermediate layer is 400 to 900%.