| 摘要 |
Provided is a substrate dividing apparatus provided with a suction inversion mechanism capable of shortening a working time between inverting a substrate and placing the substrate on a table corresponding to a next process. The substrate dividing apparatus includes: a scribe device (D) configured to form a scribe line on a surface of a substrate (W) made of a brittle material; a transfer mechanism (E) configured to transfer the scribed substrate (W) to a suction inversion mechanism (G); the suction inversion mechanism (G) having a suction plate (29) formed to be inverted by a rotary shaft (28), and configured to receive the substrate (W) from the transfer mechanism (E), to invert the substrate vertically, and to place the inverted substrate on a table (15) of a brake device (F); and the brake device (F) configured to brake the substrate (W) received from the suction inversion mechanism (G). The rotary shaft (28) of the suction plate (29) of the suction inversion mechanism (G) is arranged in succession in a direction approximately orthogonal to the transfer direction of the substrate (W) on one end of the suction plate (29). The rotary shaft (28) is arranged near the table (15) of the brake device (F) so as to invert the suction plate (29), which sucks the substrate (W), using the rotary shaft (29) as a support point and to place the inverted substrate (W) on the table (15) of the brake device (F). |
