发明名称 Thermal insulation board with embedded low thermal conductivity thermal insulation elements and assembly kit for same
摘要 <p>The board has chambers (6) arranged between a covering layer plate (4) and a barrier layer for arrangement at a masonry (1). The chambers have a heat insulating unit (8) of low thermal conductivity. The covering layer plate and the barrier layer serve as a barrier layer plate (3) made of capillary-active insulation material. The chambers are enclosed by capillary-active chamber bars (5) at all sides. The chamber bars are capillary-active connected with the covering layer plate and the barrier layer plate. The chamber bars are connected with the covering and barrier layer plates. An independent claim is also included for a kit for assembly of a thermal insulation board.</p>
申请公布号 EP2460945(B1) 申请公布日期 2014.05.14
申请号 EP20110007395 申请日期 2011.09.09
申请人 CALSITHERM VERWALTUNGS GMBH 发明人 HÖLSCHER, KLAUS, DR.;HÖLSCHER, TOBIAS, DR.;SCHNEIDER, HANS-JÜRGEN, DR.;LENGEN, AXEL;STELLMACH, WINFRIED, DR.
分类号 E04B1/76 主分类号 E04B1/76
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