| 摘要 |
A method for manufacturing a woven mesh substrate with semiconductor elements (1), in which a plurality of spherical semiconductor elements (3) having a light-receiving function or a light -emitting function are installed to a woven mesh substrate (2) in net form in which a plurality of vertical strands (21) are insulating lines and a plurality of horizontal strands (22) are electrically conductive lines, including: a first step of shifting, with a heddle mechanism (53), a first group of vertical strands (21a) including a plurality of vertical strands and a second group of vertical strands (21b) including a plurality of vertical strands positioned parallel to this first group of vertical strands and alternatingly therewith, and creating a gap between the first and second groups of vertical strands; a second step of supplying a horizontal strand (22) through the gap with a shuttle mechanism (54); a third step of pushing this horizontal strand (22) with a reed mechanism (55); a fourth step of applying conductive junction blobs (49) at a plurality of sites on this horizontal strand that has been reed pushed corresponding to all or a part of the net meshes (23); and a fifth step of installing a plurality of spherical semiconductor elements (3) corresponding to all or a portion of the plurality of sites at which conductive junction blobs (49) have been applied by this fourth step, thus connecting a plurality of their first electrodes (32) or of their second electrodes (31) to the horizontal strand. |
