| 摘要 |
PROBLEM TO BE SOLVED: To reduce warp of a semiconductor device being manufactured by face-down bonding a thin semiconductor chip to a flexible circuit board by using thermosetting resin. SOLUTION: Bonding resin 4 is cured under a state where a part of a semiconductor substrate located in the center of a semiconductor chip 1 is flexed to the opposite side of the chip 1. A circuit board 3 is sucked onto a bonding stage 5 having a recess 6 and flexed by pulling it into the evacuated recess 6. Since flexure of the circuit board 3 decreases as bonding resin shrinks when curing or cooling and a bending stress being applied to the circuit board 3 or the like through shrinkage is offset, warp of the semiconductor device is reduced. COPYRIGHT: (C)2011,JPO&INPIT |
