| 摘要 |
<p>The present invention relates to a positive polyamide varnish capable of alkaline development due to improved solubility in an alkaline developing solution of the present invention. A polyimide film manufactured using the positive polyamide varnish reduces developing time and facilitates fine patterns due to low resolution, therefore being suitable for use in the passivation film of a semiconductor, the coating of a silicon wafer, the protective film of a semiconductor device, the insulating layer of a display with an organic light emitting diode, the insulating film of a multi-layered printed circuit board, a liquid crystal alignment film, and a solder-resist film.</p> |
