| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which ensures the adhesion between plating layers regardless of materials forming the plating layers without performing special process when the multiple plating layers are laminated, and to provide a manufacturing method of semiconductor package.SOLUTION: A manufacturing method of a wiring board includes: a pad formation process where a pad, formed by laminating multiple plating layers, is formed on a support medium; an insulation layer formation process where an insulation layer covering the pad is formed on the support medium; a support medium removal process where the support medium is removed to expose a part of the pad from a support medium removal surface of the insulation layer. In the pad formation process, after a surface of one plating layer is roughened, a plating layer, forming a next layer, is laminated on the roughened surface. |
