SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

A semiconductor package includes: a mounting substrate having a chip-mounting region and a peripheral region; a first semiconductor chip mounted on the chip-mounting region of the mounting substrate; a first molding member which covers at least part of the first semiconductor chip on the mounting substrate, first conductive connection members which penetrate at least part of the first molding member, protruded from the first molding member, is electrically connected to each ground connection pad which is formed on the peripheral region of the mounting substrate; and an electromagnetic shield member arranged on the upper part of the first molding member to cover the first semiconductor chip, supported on the first conductive connection members, is separated from the first molding member.