发明名称 Semiconductor device and fabricating method thereof
摘要 A semiconductor device is provided. The device includes a semiconductor substrate and a gate structure thereon. A well region is formed in the semiconductor substrate. A drain region and a source region are respectively formed in the semiconductor substrate inside and outside of the well region. At least one set of the first and second heavily doped regions is formed in the well region between the drain region and the source region, wherein the first and second heavily doped regions are stacked vertically from bottom to top and have a doping concentration which is larger than that of the well region. The semiconductor substrate and the first heavily doped region have a first conductivity type and the well region and the second heavily doped region have a second conductivity type. A method for fabricating a semiconductor device is also disclosed.
申请公布号 US8723256(B1) 申请公布日期 2014.05.13
申请号 US201213670951 申请日期 2012.11.07
申请人 VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION 发明人 LIN WEN-CHENG;TU SHANG-HUI;LIN SHIN-CHENG
分类号 H01L29/66 主分类号 H01L29/66
代理机构 代理人
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