发明名称 |
Integrated circuit packaging system having warpage prevention structures |
摘要 |
A method of manufacture of an integrated circuit packaging system includes providing a substrate; connecting an integrated circuit die; forming a molding having a temperature-dependent characteristic directly on the top surface of the substrate; and forming a coupling encapsulation having a coupled characteristic different from the temperature-dependent characteristic directly on the molding forms an encapsulation boundary between the coupling encapsulation and the molding. |
申请公布号 |
US8723310(B2) |
申请公布日期 |
2014.05.13 |
申请号 |
US201213526877 |
申请日期 |
2012.06.19 |
申请人 |
PARK YISU;LEE KYUNGHOON;YANG JOUNGLN;PARK SANGMI;CHOI DAESIK;STATS CHIPPAC LTD. |
发明人 |
PARK YISU;LEE KYUNGHOON;YANG JOUNGLN;PARK SANGMI;CHOI DAESIK |
分类号 |
H01L23/10 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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