发明名称 Method for designing a semiconductor device including stress films
摘要 A method for designing a semiconductor device includes arranging at least a pattern of a first active region in which a first transistor is formed and a pattern of a second active region in which a second transistor is formed; arranging at least a pattern of a gate wire which intersects the first active region and the second active region; extracting at least a first region in which the first active region and the gate wire are overlapped with each other; arranging at least one pattern of a compressive stress film on a region including the first active region; and obtaining by a computer a layout pattern of the semiconductor device, when the at least one pattern of the compressive stress film is arranged, end portions of the at least one pattern thereof are positioned based on positions of end portions of the first region.
申请公布号 US8723237(B2) 申请公布日期 2014.05.13
申请号 US201313734125 申请日期 2013.01.04
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 TORII YASUNOBU
分类号 H01L21/8238;H01L29/78 主分类号 H01L21/8238
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