发明名称 Compound semiconductor device and manufacture process thereof
摘要 A compound semiconductor device includes a compound semiconductor layer, a gate electrode disposed above the compound semiconductor layer, and a gate insulation film. The gate insulation film is interposed between the compound semiconductor layer and the gate electrode. The gate insulation film contains a fluorine compound at least in the vicinity of the interface with the compound semiconductor layer.
申请公布号 US8722476(B2) 申请公布日期 2014.05.13
申请号 US201113291576 申请日期 2011.11.08
申请人 KAMADA YOICHI;FUJITSU LIMITED 发明人 KAMADA YOICHI
分类号 H01L21/338 主分类号 H01L21/338
代理机构 代理人
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