发明名称 |
Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component |
摘要 |
A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier. |
申请公布号 |
US8723192(B2) |
申请公布日期 |
2014.05.13 |
申请号 |
US201013320304 |
申请日期 |
2010.07.19 |
申请人 |
WEIDNER KARL;WIRTH RALPH;KALTENBACHER AXEL;WEGLEITER WALTER;BARCHMANN BERND;WUTZ OLIVER;MARFELD JAN;OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
WEIDNER KARL;WIRTH RALPH;KALTENBACHER AXEL;WEGLEITER WALTER;BARCHMANN BERND;WUTZ OLIVER;MARFELD JAN |
分类号 |
H01L29/18 |
主分类号 |
H01L29/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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