发明名称 |
Liquid resin composition and semiconductor device |
摘要 |
According to the invention, a liquid resin composition which has favorable wet spreadability after mounting of a chip and exhibits excellent solder cracking resistance even in a high-temperature solder reflow process at about 260° C., i.e., even when being used in lead-free solder, and a semiconductor package using the liquid resin composition are provided. In the liquid resin composition of the invention, an acrylic copolymer having a radical polymerizable functional group contains alkyl(meth)acrylate as a constituent monomer having a linear or branched alkyl group having 6 to 9 carbon atoms in an amount of 10 wt % to 40 wt % of the entire constituent monomers. |
申请公布号 |
US8722768(B2) |
申请公布日期 |
2014.05.13 |
申请号 |
US201113817351 |
申请日期 |
2011.09.26 |
申请人 |
MAKIHARA KOUJI;MURAYAMA RYUICHI;SUMITOMO BAKELITE CO., LTD. |
发明人 |
MAKIHARA KOUJI;MURAYAMA RYUICHI |
分类号 |
C09J163/00;C08F20/10;C08J5/12;C09J133/08;C09J133/10;C09J151/00;C23C18/00;C23C18/12;C23C18/16;H01L21/52 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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