| 摘要 |
An apparatus and method for depositing a thin film comprise: a deposition chamber; a deposition source prepared in the bottom of the deposition chamber to deposit a thin film to a substrate by providing a deposition material toward the substrate carried in the deposition chamber; a carrier which chucks the substrate such that one side of the substrate for thin film deposition is directed toward the deposition source, and transfers the substrate to be carried in and carried out of the deposition chamber; a first sensor prepared in the carrier to sense the thickness of the thin film to be deposited on the substrate; a transmitting unit connected to the first sensor to transmit a signal sensed by the first sensor to the outside; a receiving unit prepared to wirelessly receive the signal transmitted from the transmitting unit; and a control unit which is connected to the receiving unit to receive the signal received from the receiving unit, and performs real time monitoring for the thickness of the thin film to be deposited on the substrate by the signal received from the receiving unit. [Reference numerals] (27) Control unit; (31) Temperature control unit |
