发明名称 SURFACE MOUNTED APPARATUS
摘要 The present invention provides a surface mounted apparatus which includes an apparatus body arranged in a substrate where a mounting region is formed; an electronic component supply unit which supplies electronic components; an electronic component transfer unit which is installed in the apparatus body and transfers the electronic components from the electronic component supply unit to the mounting region; and an adhesive supply unit which supplies adhesive to the mounting surface of the electronic component where the electronic component of a size which is greater than the predetermined size is formed to mount it on the mounting region by using the electronic component transfer unit when the size of the electronic component is greater than the predetermined size.
申请公布号 KR101393678(B1) 申请公布日期 2014.05.13
申请号 KR20130004914 申请日期 2013.01.16
申请人 BK ELECTRONICS CO., LTD. 发明人 KIM, JUNE MAN;OH, DONG HYUN
分类号 H01L21/48 主分类号 H01L21/48
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