| 摘要 |
<p>The present invention relates to a semiconductor package accommodating tube which is integrally formed with a stopper. According to an embodiment of the present invention to this end, the semiconductor package accommodating tube may include an accommodating unit formed in a tubular shape and accommodating at least one semiconductor package therein; and the stopper formed on at least one step of the accommodating unit and formed by bending and deforming a portion of the accommodating unit.</p> |
