摘要 |
PURPOSE: A spin chuck and a single wafer type cleaning apparatus comprising the same are provided to prevent a cleaning liquid flowing in through a joint part of a chuck pin and the spin chuck, by forming a purge line providing a purge gas between the chuck pin and the spin chuck. CONSTITUTION: A spin chuck(120) comprises a stage(121), plural chuck pins(123), a rotary shaft rotating the spin chuck and a rotation driving part. The stage forms a main body of the spin chuck. The rotary shaft and the rotation driving part are formed in the lower part of the stage. The stage has a circular plate form corresponding to the substrate. A second cleaning liquid supply part(150) is placed in a rear side cleaning unit(125). The second cleaning liquid supply part supplies a purge gas to the rear side of the substrate. A purge line(126) is formed in the rear side cleaning unit for the second cleaning liquid supply part to supply a part of the purge gas to the chuck pin. The purge gas is supplied to a joint part(124) of the stage and the chuck pin. |