| 发明名称 |
Packaged integrated circuit devices with through-body conductive vias, and methods of making same |
| 摘要 |
A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material. |
| 申请公布号 |
US8723307(B2) |
申请公布日期 |
2014.05.13 |
| 申请号 |
US20100852925 |
申请日期 |
2010.08.09 |
| 申请人 |
JIANG TONGBI;CHIA YONG POO;MICRON TECHNOLOGY, INC. |
发明人 |
JIANG TONGBI;CHIA YONG POO |
| 分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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