| 摘要 |
A method and system for forming a thin semiconductor device are disclosed. In one embodiment, a lead frame is provided over a carrier. At least one semiconductor chip is provided on the lead frame and the at least one semiconductor chip is enclosed with an encapsulating material. The thickness of the at least one semiconductor chip and the encapsulating material are reduced. At least one through connection is formed in the encapsulating material and at least one electrical contact element is formed over the at least one semiconductor chip and the at least one through connection. |
