| 摘要 |
PURPOSE: A method and apparatus for centering a spin-chuck is provided to improve the wafer cleaning efficiency of the single wafer process by compensating a center of a spin chuck by measuring a distance with which the center of the spin chuck deviates from a reference position. CONSTITUTION: A spin chuck(210) supports a substrate(W) to be rotatable. A nozzle(220) is provided on a top of the substrate and supplies the substrate with the washing solution. A reference member(230) is settled on the top of the spin chuck, and protrudes in the circumference of the spin chuck. A distance measurement sensor member(240) is installed to the nozzle, and measures the distance between the reference member and the nozzle. The reference member is in the cylindrical shape, and is formed higher than the distance measurement sensor member. The reference member comprises the settling portion and the receiving projection. |
