发明名称 |
Integrated circuit packaging system with through silicon via and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a bottom integrated circuit having bottom through silicon vias with a bottom via pitch; mounting outer interconnects over the bottom integrated circuit; and mounting a top integrated circuit between the outer interconnects, the top integrated circuit having top through silicon vias with a top via pitch less than the bottom via pitch. |
申请公布号 |
US8723309(B2) |
申请公布日期 |
2014.05.13 |
申请号 |
US201213517897 |
申请日期 |
2012.06.14 |
申请人 |
SHIN HANGIL;PARK YEONGIM;CHI HEEJO;STATS CHIPPAC LTD. |
发明人 |
SHIN HANGIL;PARK YEONGIM;CHI HEEJO |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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