发明名称 Hybrid MEMS bump design to prevent in-process and in-use stiction
摘要 A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.
申请公布号 US8723280(B2) 申请公布日期 2014.05.13
申请号 US201213563935 申请日期 2012.08.01
申请人 SHU CHIA-PAO;TAI WEN-CHUAN;HUNG CHIA-MING;CHEN HSIANG-FU;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 SHU CHIA-PAO;TAI WEN-CHUAN;HUNG CHIA-MING;CHEN HSIANG-FU
分类号 H01L29/82 主分类号 H01L29/82
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