发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device is disclosed. The semiconductor device includes: a substrate; a gate structure disposed on the substrate, wherein the gate structure has a high-k dielectric layer; a first seal layer disposed on a sidewall of the gate structure, wherein the first seal layer is an oxygen-free seal layer and is non-L-shaped; and a second seal layer disposed on a sidewall of the first seal layer, wherein the second seal layer is an L-shaped seal layer.
申请公布号 US8723274(B2) 申请公布日期 2014.05.13
申请号 US201313899592 申请日期 2013.05.22
申请人 UNITED MICROELECTRONICS CORP. 发明人 HUANG WEI-HANG
分类号 H01L21/02;H01L21/3205 主分类号 H01L21/02
代理机构 代理人
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