MANUFACTURING OF FAN-OUT WAFER LEVEL PACKAGING FORTIFIED PREVENTING WARPAGE OF WAFER

摘要

The present invention relates to a fan-out wafer lever packaging process for warpage prevention and thermal radiation. More particularly, the method comprises the following steps: (S10) taping two sided adhesive tape on a carrier; (S20) arranging silicon chips on the two sided adhesive tape; (S30) molding the arranged silicon chips with epoxy molding compound; (S60) separating the carrier and two sided adhesive tape from the silicon chips; (S70) forming a re-division layer on the silicon chip at a spot in which the carrier and two sided adhesive tape are separated; (S80) forming a solder ball for transmitting signals to the re-division layer; and (S90) dicing for cutting the wafer passed the step (S80) which forms the solder ball into a silicon chip size. Right after the molding step (S30), forming step of an adhesive layer on the epoxy molding compound (S40), and forming step of warpage prevention layer on the adhesive layer (S50) are added in the fan-out wafer lever packing process in which a warpage prevention function of wafer is strengthened.