发明名称 |
Heat dissipation structure |
摘要 |
A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board. |
申请公布号 |
US8724326(B2) |
申请公布日期 |
2014.05.13 |
申请号 |
US201213456498 |
申请日期 |
2012.04.26 |
申请人 |
YANG CHIH-HAO;SHI BAO-QUAN;YANG RONG;ZENG XIANG-KUN;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
YANG CHIH-HAO;SHI BAO-QUAN;YANG RONG;ZENG XIANG-KUN |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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