METHOD OF MANUFACTURING ELECTRONIC DEVICE, BONDING DEVICE OF CONTAINER FOR ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND MOBILE APPARATUS

摘要

PROBLEM TO BE SOLVED: To obtain means for improving poor airtightness of a container for electronic component by using an energy beam bonding method.SOLUTION: A bonding method of a container including a base substrate 21, and a lid 22 for forming a space between the base substrate 21 includes a step for preparing the base substrate 21 and the lid 22, a step for arranging the lid 22 in the bonding region 23 of the base substrate 21 so as to overlap, a step for bringing a press part 1 into contact with the outer surface of the lid 22 on the inside of the bonding region 23, and a bonding step for bonding the lid 22 by irradiating an energy beam L, while bringing the press part 1 into contact with the lid 22.