| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, a prepreg, a laminate, and a printed wiring board which are excellent in heat resistance, a thermal expansion coefficient, surface smoothness and warp reduction.SOLUTION: A thermosetting resin composition contains (A) a maleimide compound having at least two N-substitution maleimide groups in one molecular structure, (B) a silicone compound having at least one reactant organic group in one molecular structure and (C) a leveling agent. A prepreg, a laminate and a printed wiring board are obtained using the thermosetting resin composition. |
