发明名称 COIL DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To reduce a coil device in size by improving heat dissipation efficiency of a core body which is formed from a first core thermally coupled to a metallic housing and a second core thermally and magnetically coupled to the first core at a side far from the metallic housing, and built in the metallic housing.SOLUTION: A coil device comprises: a metallic housing 1; a core body which is formed from a first core 3 thermally coupled to the metallic housing and a second core 2 thermally and magnetically coupled to the first core at a side far from the metallic housing, and built in the metallic housing; a winding wire 10 which is wound around the core body and defines the first core and the second core as a magnetic path; a heat dissipation plate 4 brought into surface-contact with a surface of the second core at the side far from the metallic housing; and a presser spring 7 which elastically presses the heat dissipation plate against the surface of the second core at the side far from the metallic housing.</p>
申请公布号 JP2014086432(A) 申请公布日期 2014.05.12
申请号 JP20120231412 申请日期 2012.10.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIZUNO TAKAHIRO ; YANO TAKUTO ; ISHIKURA HISASHI ; TAKADA ATSUTOSHI ; SUGAYA YUJI ; HIRAMATSU DAISUKE ; KUMAGAI TAKASHI ; TASHIRO SHOJIRO ; SHIRAKATA YUJI
分类号 H01F27/22;H01F27/08;H01F27/28;H01F30/00;H01F37/00 主分类号 H01F27/22
代理机构 代理人
主权项
地址