| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin mold device and a resin mold method which enable a molding to be smoothly released from a mold after the resin molding without impairing the mold quality.SOLUTION: An upper mold 8 is provided with: multiple first vent holes 16a provided at a circumferential groove 16 which is formed enclosing a workpiece holding area; and multiple second vent holes 13e which causes an upper mold clamp surface to suction a release film F or jets air to separate the release film F from the upper mold clamp surface. In a lower mold 7, film support pins 27 which are constantly biased so as to be pressed against the release film F are provided protruding therefrom. |
