发明名称 MULTILAYER CAPACITOR AND PACKAGING STRUCTURE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayer capacitor capable of making space saving compatible with low ESL in a condition including an internal structure and a packaging structure, and managing high-density packaging of components, and the packaging structure thereof.SOLUTION: A noise current superimposed on a power line flows through hot-side external electrodes 52a, 52b into a capacitor, passes through a hot-side internal electrode layer 54 connected to a core-shaped conductor 57 penetrating the central parts of layers 54, 55, 56 and a ground-side internal electrode layer 55 opposing the layer 54, and flows through ground-side external electrodes 53a, 53b, 53c, 53d to the outside of the capacitor. In such a case, a plurality of ground-side external electrodes 53a, 53b, 53c, 53d are disposed around the core-shaped conductor 57, thereby forming a plurality of passages of the noise current refluxed from the power line to the ground.</p>
申请公布号 JP2014086680(A) 申请公布日期 2014.05.12
申请号 JP20120236988 申请日期 2012.10.26
申请人 MURATA MFG CO LTD 发明人 KANEZAKI AKIO
分类号 H01G4/35;H01G2/06;H01G4/30 主分类号 H01G4/35
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