| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element excellent in reliability, which prevents peeling and cracks of a protection layer in a semiconductor element such as an LED element.SOLUTION: A semiconductor element comprises: a junction layer 13 formed on a substrate 11; an element structure layer formed on the junction layer; an insulation protective layer 29 which extends from a lateral face of the element structure layer to a top face of the junction layer and at a distance from an end of the top face to the junction layer: and a fixed protective layer which extends from the top face of the junction layer, which is exposed from the insulation protective layer to the top face of the insulation protective layer and which is composed of a metal oxide. The fixed protective layer includes an adhesion layer 31A formed in contact with the junction layer and a reinforcement layer 31B formed on the adhesion layer. The adhesion layer is composed of a low-oxygen metal oxide lower than the reinforcement layer. |
