发明名称 |
STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION |
摘要 |
A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings. |
申请公布号 |
KR20140057366(A) |
申请公布日期 |
2014.05.12 |
申请号 |
KR20147008251 |
申请日期 |
2012.10.09 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KURAFUCHI KAZUHIKO;FUJIMOTO DAISUKE;YAMADA KUNPEI;NAGOSHI TOSHIMASA |
分类号 |
H05K3/46;H05K3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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