| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a pressure sensor device capable of reducing influence of impact acceleration and assuring reliability of a bonding wire, and a method of manufacturing the same.SOLUTION: The pressure sensor device 10 includes a guide member 11 having a cylindrical portion 11b disposed so as to be opposed to a sensing portion 17a: thickness of a protective member 12 being formed thinner in portions having the cylindrical portion 11b than in portions having the cylindrical portion 11b. In this structure, influence of impact acceleration can be reduced, and false detection of the sensor chip 17 can be eliminated (or greatly reduced) because thickness of the protective member 12 on the sensor chip 17 is formed thin. Furthermore, the bonding wire 13 is wholly covered with the protective member 12. Thus a malfunction concerning exposure of the bonding wire 13 can be prevented to assure reliability.</p> |
