| 摘要 |
PROBLEM TO BE SOLVED: To lessen or reduce crosstalk between the bonding wires or between the interconnections in a device substrate.SOLUTION: As one selection form, a multiplex terminal group (102_apif) is divided functionally into three groups, differently from other selection forms for dividing into two groups, and a pin-multi first semiconductor device (1) is constituted by sequentially arranging each group along one side of a chip. The first semiconductor device (1) is connected with a second semiconductor device (2) via a multiplex terminal group, or the like. The multiplex terminal group is first to third interface terminal groups (102_o, 102_i, 102_io) having signal I/O forms different from each other. |
