发明名称 MAGNETRON SPUTTERING APPARATUS, AND MAGNETRON SPUTTERING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a magnetron sputtering method in a magnetron sputtering apparatus, for increasing an erosion region in accordance with the enlargement of a target area while minimizing a used amount of a magnet.SOLUTION: A plurality of magnetic induction members (11) are so arrayed in the direction of a rotation axis Ct that at least a portion may be arranged between a rotary magnet and a stationary magnet (38) in a direction to cross the direction of the rotation axis Ct, as viewed from the side of a target (21). The magnetic field of a magnet in a state relatively apart from the target (21) is utilized as one for confining a plasma.</p>
申请公布号 JP2014084531(A) 申请公布日期 2014.05.12
申请号 JP20130243027 申请日期 2013.11.25
申请人 TOHOKU UNIV 发明人 GOTO TETSUYA
分类号 C23C14/35 主分类号 C23C14/35
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