| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition and method for removing copper-containing post-etch and/or post-ash residues from patterned microelectronic devices.SOLUTION: The removal composition includes water, a water-miscible organic solvent, an amine compound, an organic acid, and a fluoride ion source. The compositions effectively remove the copper-containing post-etch residues from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials. |
